Introduction to Microelectronics Advanced Packaging Assurance

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

Author: Navid Asadizanjani,Himanandhan Reddy Kottur,Hamed Dalir
Binding Type: Hardcover
Publisher: Springer
Published: 04/23/2025
Series: Synthesis Lectures on Engineering, Science, and Technology
Pages: 183
Weight: 1.17lbs
Size: 9.61h x 6.69w x 0.50d
ISBN: 9783031861017