• Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration by Lau, John
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Springer

Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration

Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration

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Author: John Lau,Kuo-Ning Chiang
Binding Type: Hardcover
Publisher: Springer
Published: 06/01/2026
Pages: 547
Weight: 2.14lbs
Size: 9.21h x 6.14w x 1.25d
ISBN: 9789819568901
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