{"product_id":"cu-interconnects-glass-and-ai-assisted-simulation-for-chiplets-and-heterogeneous-integration-9789819568901","title":"Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration","description":"\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e John Lau,Kuo-Ning Chiang\u003cbr\u003e\u003cb\u003eBinding Type:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Springer\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 06\/01\/2026\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 547\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 2.14lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.21h x 6.14w x 1.25d\u003cbr\u003e\u003cb\u003eISBN:\u003c\/b\u003e 9789819568901","brand":"Springer","offers":[{"title":"Default Title","offer_id":48254419042441,"sku":"9789819568901","price":219.99,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0636\/9240\/6921\/files\/img_40cf9200-08cb-4107-a68f-8ed1a8427d28.jpg?v=1788301579","url":"https:\/\/sonsanddaughtersbooks.com\/products\/cu-interconnects-glass-and-ai-assisted-simulation-for-chiplets-and-heterogeneous-integration-9789819568901","provider":"Sons and Daughters Books","version":"1.0","type":"link"}